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[ACM Press the conference - Munich, Germany (2008.03.10-2008.03.14)] Proceedings of the conference on Design, automation and test in Europe - DATE '08 - High-frequency mutual impedance extraction of VLSI interconnects in the presence of a multi-layer conducting substrate
Srivastava, Navin, Suaya, Roberto, Banerjee, KaustavYear:
2008
Language:
english
DOI:
10.1145/1403375.1403478
File:
PDF, 374 KB
english, 2008