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Transparent and electrically conductive GaSb/Si direct wafer bonding at low temperatures by argon-beam surface activation
Predan, F., Reinwand, D., Klinger, V., Dimroth, F.Volume:
353
Language:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2015.07.048
Date:
October, 2015
File:
PDF, 1.12 MB
english, 2015