Encapsulated High Temperature PCM as Active Filler Material...

Energy Procedia 2015 / 05 Vol. 69

Encapsulated High Temperature PCM as Active Filler Material in a Thermocline-based Thermal Storage System

Muñoz-Sánchez, B., Iparraguirre-Torres, I., Madina-Arrese, V., Izagirre-Etxeberria, U., Unzurrunzaga-Iturbe, A., García-Romero, A.
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Volume:
69
Language:
english
Journal:
Energy Procedia
DOI:
10.1016/j.egypro.2015.03.177
Date:
May, 2015
File:
PDF, 365 KB
english, 2015
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