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Annealing-free adhesive electroless deposition of a nickel/phosphorous layer on a silane-compound-modified Si wafer
Wei, Tzu-Chien, Pan, Tseng-Chieh, Chen, Chih-Ming, Lai, Kuei-Chang, Wu, Chung-HanVolume:
54
Language:
english
Journal:
Electrochemistry Communications
DOI:
10.1016/j.elecom.2015.02.009
Date:
May, 2015
File:
PDF, 796 KB
english, 2015