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Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
Li, Jianfeng, Johnson, Christopher Mark, Buttay, Cyril, Sabbah, Wissam, Azzopardi, StéphaneVolume:
215
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2014.08.002
Date:
January, 2015
File:
PDF, 2.92 MB
english, 2015