Supercritical fluid chemical deposition of Cu in Ru and...

Microelectronic Engineering 2015 / 04 Vol. 137

Supercritical fluid chemical deposition of Cu in Ru and TiN-lined deep nanotrenches using a new Cu(I) amidinate precursor

Rasadujjaman, Md, Watanabe, Mitsuhiro, Sudoh, Hiroshi, Machida, Hideaki, Kondoh, Eiichi
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Volume:
137
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2014.11.021
Date:
April, 2015
File:
PDF, 1.91 MB
english, 2015
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