Stress analyses of high spatial resolution on TSV and BEoL...

Microelectronics Reliability 2014 / 09 Vol. 54; Iss. 9-10

Stress analyses of high spatial resolution on TSV and BEoL structures

Vogel, D., Auerswald, E., Auersperg, J., Bayat, P., Rodriguez, R.D., Zahn, D.R.T., Rzepka, S., Michel, B.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.07.098
Date:
September, 2014
File:
PDF, 1.76 MB
english, 2014
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