Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder...

Materials Science and Engineering: A 2014 / 09 Vol. 613

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Xiao, Gesheng, Yuan, Guozheng, Jia, Chunnan, Yang, Xuexia, Li, Zhigang, Shu, Xuefeng
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Volume:
613
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2014.06.113
Date:
September, 2014
File:
PDF, 1.17 MB
english, 2014
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