[AIP Stress-induced Phenomena in Metallization - ()] AIP Conference Proceedings - Microstructure Effect on EM-induced Degradations in Dual-Inlaid Copper Interconnects
Kteyan, A., Sukharev, V., Meyer, M.-A., Zschech, E., Nix, W. D., Ogawa, Shinichi, Ho, Paul S., Zschech, EhrenfriedVolume:
945
Year:
2007
Language:
english
DOI:
10.1063/1.2815783
File:
PDF, 1.52 MB
english, 2007