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AIP Conference Proceedings [AIP INTERNATIONAL CONFERENCE ON ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES (AMPT2010) - Paris, (France) (24–27 October 2010)] - Printability Optimization For Fine Pitch Solder Bonding
Kwon, Sang-Hyun, Lee, Chang-Woo, Yoo, Sehoon, Chinesta, Francisco, Chastel, Yvan, El Mansori, MohamedYear:
2011
Language:
english
DOI:
10.1063/1.3552565
File:
PDF, 337 KB
english, 2011