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AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability
Sukharev, Valeriy, Zschech, EhrenfriedYear:
2014
Language:
english
DOI:
10.1063/1.4881339
File:
PDF, 2.11 MB
english, 2014