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AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen, Sukharev, Valeriy, Zschech, EhrenfriedYear:
2014
Language:
english
DOI:
10.1063/1.4881345
File:
PDF, 752 KB
english, 2014