[ACM Press the The 51st Annual Design Automation Conference - San Francisco, CA, USA (2014.06.01-2014.06.05)] Proceedings of the The 51st Annual Design Automation Conference on Design Automation Conference - DAC '14 - Contactless Stacked-die Testing for Pre-bond Interposers
Chien, Jui-Hung, Hsu, Ruei-Siang, Lin, Hsueh-Ju, Yeh, Ka-Yi, Chang, Shih-ChiehYear:
2014
Language:
english
DOI:
10.1145/2593069.2593111
File:
PDF, 908 KB
english, 2014