Simulating In-Situ Leaching Process Using Comsol...

International Journal of Electronics and Telecommunications 2014 / 01 Vol. 60; Iss. 3

Simulating In-Situ Leaching Process Using Comsol Multiphysics

Mukhanov, Bakhyt K., Omirbekova, Zhanar Zh., Usenov, Azamat K., Wójcik, Waldemar
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Volume:
60
Language:
english
Journal:
International Journal of Electronics and Telecommunications
DOI:
10.2478/eletel-2014-0026
Date:
January, 2014
File:
PDF, 1.12 MB
english, 2014
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