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Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process
Lee, Jongsu, Park, Sungsik, Park, Janghoon, Cho, Young Seek, Shin, Kee-Hyun, Lee, DongjinVolume:
16
Language:
english
Journal:
International Journal of Precision Engineering and Manufacturing
DOI:
10.1007/s12541-015-0262-3
Date:
August, 2015
File:
PDF, 1.22 MB
english, 2015