[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Toral, G., Temiz, Y., Leblebici, Y.Year:
2009
Language:
english
DOI:
10.1109/3DIC.2009.5306530
File:
PDF, 2.85 MB
english, 2009