A Model of Air-Gap Through-Silicon Vias (TSVs) for...

IEEE Microwave and Wireless Components Letters 2015 / 8 Vol. 25; Iss. 8

A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications

Liu, Xiaoxian, Zhu, Zhangming, Yang, Yintang, Ding, Ruixue
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Volume:
25
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/lmwc.2015.2440659
Date:
August, 2015
File:
PDF, 709 KB
english, 2015
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