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Study and characterization on the nanocomposite underfill for flip chip applications
Yangyang Sun,, Zhuqing Zhang,, Wong, C.P.Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.870389
Date:
March, 2006
File:
PDF, 1.26 MB
english, 2006