![](/img/cover-not-exists.png)
Review of trench and via plasma etch issues for copper dual damascene in undoped and fluorine-doped silicate glass oxide
D. L. Keil, B. A. Helmer, S. LassigYear:
2003
Language:
english
DOI:
10.1116/1.1603293
File:
PDF, 1.67 MB
english, 2003