Review of trench and via plasma etch issues for copper dual...

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Review of trench and via plasma etch issues for copper dual damascene in undoped and fluorine-doped silicate glass oxide

D. L. Keil, B. A. Helmer, S. Lassig
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Year:
2003
Language:
english
DOI:
10.1116/1.1603293
File:
PDF, 1.67 MB
english, 2003
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