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Low temperature plasma-assisted chemical vapor deposition of tantalum nitride from tantalum pentabromide for copper metallization
X. Chen, H. L. Frisch, A. E. Kaloyeros, B. Arkles, J. SullivanYear:
1999
Language:
english
DOI:
10.1116/1.590533
File:
PDF, 3.42 MB
english, 1999