![](/img/cover-not-exists.png)
Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization
J. E. Kelsey, C. Goldberg, G. Nuesca, G. Peterson, A. E. Kaloyeros, B. ArklesYear:
1999
Language:
english
DOI:
10.1116/1.590703
File:
PDF, 762 KB
english, 1999