Low temperature metal-organic chemical vapor deposition of...

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Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization

J. E. Kelsey, C. Goldberg, G. Nuesca, G. Peterson, A. E. Kaloyeros, B. Arkles
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Year:
1999
Language:
english
DOI:
10.1116/1.590703
File:
PDF, 762 KB
english, 1999
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