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AIP Conference Proceedings [AIP THE 4TH INTERNATIONAL MEETING OF ADVANCES IN THERMOFLUIDS (IMAT 2011) - Melaka, Malaysia (3–4 October 2011)] - Development of vapor pressure in FR4-copper composite material during solder reflow process
Kamsah, Nazri, Tamin, Mohd Nasir, Kamar, Haslinda Mohamed, Lahuri, Hidayatunnur, Wagiman, Amir Nur RashidYear:
2012
Language:
english
DOI:
10.1063/1.4704209
File:
PDF, 557 KB
english, 2012