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Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn–Cu solder or solid Sn–Cu solder at 222°C: Experimental results versus theoretical model calculations
Liashenko, O. Yu, Hodaj, F.Volume:
99
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2015.07.066
Date:
October, 2015
File:
PDF, 2.93 MB
english, 2015