[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Integrated module structure of fan-out wafer level package for terahertz antenna
Ishibashi, Daijiro, Sasaki, Shinya, Ishizuki, Yoshikatsu, Iijima, Shinya, Nakata, Yoshihiro, Kawano, Yoichi, Suzuki, Toshihide, Tani, MotoakiYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159729
File:
PDF, 953 KB
english, 2015