![](/img/cover-not-exists.png)
[AIP MULTISCALE AND FUNCTIONALLY GRADED MATERIALS 2006 - ()] AIP Conference Proceedings - Analytical Model for Thermal Elastoplastic Stresses of Functionally Graded Materials
Zhai, P. C., Chen, G., Liu, L. S., Fang, C., Zhang, Q. J., Paulino, Glaucio H., Pindera, Marek-Jerzy, Dodds, Robert H., Rochinha, Fernando A., Dave, Eshan, Chen, LinfengVolume:
973
Year:
2008
Language:
english
DOI:
10.1063/1.2896763
File:
PDF, 728 KB
english, 2008