Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures
2013 Vol. 31; Iss. 2
Thermal stability of Ti, Pt, and Ru interfacial layers between seedless copper and a tantalum diffusion barrier
Liu, Xin, King, Sean W., Nemanich, Robert J.Volume:
31
Year:
2013
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.4792523
File:
PDF, 2.01 MB
english, 2013