SPIE Proceedings [SPIE MOEMS-MEMS 2006 Micro and Nanofabrication - San Jose, CA (Saturday 21 January 2006)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V - Electrical breakdown across micron scale gaps in MEMS structures
Strong, Fabian W., Skinner, Jack L., Dentinger, Paul M., Tien, Norman C., Tanner, Danelle M., Ramesham, RajeshuniVolume:
6111
Year:
2006
Language:
english
DOI:
10.1117/12.646508
File:
PDF, 613 KB
english, 2006