Reliability of copper wire bonds on a novel over-pad...

Japanese Journal of Applied Physics 2015 / 05 Vol. 54; Iss. 5S

Reliability of copper wire bonds on a novel over-pad metallization

Kawashiro, Fumiyoshi, Itoh, Satoshi, Maeda, Takehiko, Hirose, Tetsuya, Yajima, Akira, Etoh, Takaki, Nishikawa, Hiroshi
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Volume:
54
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/jjap.54.05ec01
Date:
May, 2015
File:
PDF, 2.81 MB
english, 2015
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