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Process induced sub-surface damage in mechanically ground silicon wafers
Yang, Yu, De Munck, Koen, Teixeira, Ricardo Cotrin, Swinnen, Bart, Verlinden, Bert, De Wolf, IngridVolume:
23
Language:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/0268-1242/23/7/075038
Date:
July, 2008
File:
PDF, 1.41 MB
english, 2008