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[ACM Press the 25th edition - Pittsburgh, Pennsylvania, USA (2015.05.20-2015.05.22)] Proceedings of the 25th edition on Great Lakes Symposium on VLSI - GLSVLSI '15 - An Effective TSV Self-Repair Scheme for 3D-Stacked ICs
Pei, Songwei, Zhang, Jingdong, Jin, Yu, Jin, Song, Liu, Jun, Xu, WeizhiYear:
2015
Language:
english
DOI:
10.1145/2742060.2742071
File:
PDF, 579 KB
english, 2015