First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials
Bo Han, Jinping Wu, Chenggang Zhou, Bei Chen, Roy Gordon, Xinjian Lei, David A. Roberts, Hansong ChengVolume:
122
Year:
2010
Language:
english
Pages:
5
DOI:
10.1002/ange.200905360
File:
PDF, 492 KB
english, 2010