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Mechanical lapping, handling and transfer of ultra-thin wafers
Pinel, S, Tasselli, J, Bailbé, J P, Marty, A, Puech, P, Estève, DVolume:
8
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/8/4/013
Date:
December, 1998
File:
PDF, 1.33 MB
english, 1998