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40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection
Miyamoto, Y., Yoneyama, M., Imai, Y., Kato, K., Tsunetsugu, H.Volume:
34
Year:
1998
Language:
english
Journal:
Electronics Letters
DOI:
10.1049/el:19980337
File:
PDF, 363 KB
english, 1998