Granular modeling approach to electro-packaging materials

Granular modeling approach to electro-packaging materials

Tatsuhiko Aizawa, Takashi Iwai, Junji Kihara
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Volume:
28
Year:
1998
Language:
english
Pages:
9
DOI:
10.1016/s0167-6636(97)00073-2
File:
PDF, 382 KB
english, 1998
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