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Microscopy and Electrical Properties of Ge/Ge Interfaces Bonded by Surface-Activated Wafer Bonding Technology
Watanabe, Kentaroh, Wada, Kensuke, Kaneda, Hidehiro, Ide, Kensuke, Kato, Masahiro, Wada, TakehikoVolume:
50
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.50.015701
Date:
January, 2011
File:
PDF, 92 KB
english, 2011