The Anisotropic Plasma-Enhanced Chemical Vapor Deposition...

The Anisotropic Plasma-Enhanced Chemical Vapor Deposition SiO 2 /Spin-on Glass Process for 0.35 µm Technology

Chen, Lai-Juh, Hsia, Shaw-Tzeng, Chen, Kuang-Chao
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Volume:
32
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.32.6119
Date:
December, 1993
File:
PDF, 356 KB
english, 1993
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