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Improvement of the Reliability of a Cu/W–N/SiOF Multilevel Interconnect by Inserting Plasma Enhanced Chemical Vapor Deposited W–N Thin Film
Kim, Dong Joon, Sim, Hyun Sang, Lee, Seoghyeong, Kim, Yong Tae, Kim, Seong-Il, Park, Jong-WanVolume:
40
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.40.1214
Date:
March, 2001
File:
PDF, 956 KB
english, 2001