Submicron Via-Hole Filling using Al Low-Pressure Seed...

Japanese Journal of Applied Physics 2001 / 8 Vol. 40; Iss. Part 1, No

Submicron Via-Hole Filling using Al Low-Pressure Seed Process

Yun, Jong-Ho, Kim, Ku-Young, Jin, Sung-Gon, Yoon, Kyoung-Ryul, Lee, Sang-Hwa, Ryu, In-Cheol, Park, Sung-Ki
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Volume:
40
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.40.5105
Date:
August, 2001
File:
PDF, 520 KB
english, 2001
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