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Microstrip Silicon-MEMS Package for Wafer-Level Chip-Scale Microwave Packaging
Lee, Hai-Young, Kwon, Young-Soo, Song, Yo-Tak, Park, Jae-YoungVolume:
42
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.42.5531
Date:
September, 2003
File:
PDF, 198 KB
english, 2003