[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package
Pinjala, D., Khan, N., Xie Ling,, Poi-Siong Teo,, Wong, E.H., Iyer, M.K., Lee, C., Rasiah, I.J.Year:
2002
Language:
english
DOI:
10.1109/ECTC.2002.1008243
File:
PDF, 543 KB
english, 2002