Copper Filling of Deep Sub-µm Through-Holes by High-Vacuum...

Japanese Journal of Applied Physics 2006 / 2 Vol. 45; Iss. 2A

Copper Filling of Deep Sub-µm Through-Holes by High-Vacuum Planar Magnetron Sputtering Using Argon Gas with Added Nitrogen: Optimum Quantity of Nitrogen in Argon Gas

Saito, Shigeru, Uhara, Yoshio, Uenosono, Takahide, Nagata, Jyunichi, Oyama, Minemasa, Nozue, Masanori, Miura, Tsutomu, Soumura, Tetsuo, Kioka, Toshihide
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
45
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.45.736
Date:
February, 2006
File:
PDF, 98 KB
english, 2006
Conversion to is in progress
Conversion to is failed