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Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress
Chen, Po-Ying, Kung, Heng-Yu, Lai, Yi-Shao, Tsai, Ming Hsiung, Yeh, Wen-KuanVolume:
47
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.47.819
Date:
February, 2008
File:
PDF, 138 KB
english, 2008