Heat Conduction to Photoresist on Top of Wafer during Post...

Japanese Journal of Applied Physics 2008 / 11 Vol. 47; Iss. 11

Heat Conduction to Photoresist on Top of Wafer during Post Exposure Bake Process: I. Numerical Approach

Kim, Do Wan, Lee, Ji-Eun, Oh, Hye-Keun
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
47
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.47.8338
Date:
November, 2008
File:
PDF, 665 KB
english, 2008
Conversion to is in progress
Conversion to is failed