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Effect of Electron Flow Direction and Via Number on Electromigration Mechanism for Copper Dual Damascene Interconnects
Cheng, Yi-Lung, Shiau, Ming-Kai, Chung, Wei-Yuan, Wang, Ying-LangVolume:
49
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.49.124201
Date:
December, 2010
File:
PDF, 1007 KB
english, 2010