Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom...

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Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment

R. Stengl, K. Ahn, U. Gösele
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Year:
1988
Language:
english
DOI:
10.1143/JJAP.27.L2364
File:
PDF, 969 KB
english, 1988
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