Disappearance of Barrier Metal during Cu Chemical Mechanical Planarization Processing and Its Mechanism
H. Asano, A. Yasui, T. Hirano, K. Tamai, H. MorinagaYear:
2011
Language:
english
DOI:
10.1143/JJAP.50.05EC08
File:
PDF, 617 KB
english, 2011