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Influence of Nitrogen Doping on the Barrier Properties of Sputtered Tantalum Carbide Films for Copper Metallization
Wang, Shui Jinn, Tsai, Hao Yi, Sun, Shi Chung, Shiao, Ming HuaVolume:
40
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.40.6212
Date:
November, 2001
File:
PDF, 721 KB
english, 2001