Effect of Back-Etching on Residual Stress in Lead Titanate Thin Films on Si Wafer
Ohno, Tomoya, Suzuki, Hisao, Masui, Hirohisa, Ishikawa, Kenji, Fujimoto, MasayukiVolume:
43
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.43.6549
Date:
September, 2004
File:
PDF, 234 KB
english, 2004