The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices
Lee, Seong-MinVolume:
45
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.45.7677
Date:
October, 2006
File:
PDF, 415 KB
english, 2006