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Mechanism of Chemical Mechanical Planarization Induced Edge Corrosion of Copper Line for Cu/Low- k SiOC Interconnects
Hsu, Yung-Lung, Fang, Yean-Kuen, Chiang, Yen-Ting, Chou, Tse-Heng, Hong, Franklin Chau-NanVolume:
46
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.46.530
Date:
February, 2007
File:
PDF, 378 KB
english, 2007